Surface Passivation in Semiconductors
Surface passivation refers to a process of protecting the surfaces of semiconductor materials from external contaminants and unwanted interactions by applying a layer or coating
Archives Terms
Advanced packaging
Advanced packaging refers to the techniques used to package a microchip or semiconductor device in a compact and reliable way.
What Is a Microbump in Semiconductors?
Microbumps are small, raised metal bumps or spheres that connect the chip with the printed circuit board (PCB). In multichip modules they also connect the different layers of the chip.
Fan Out Wafer Level Packaging (FOWLP)
FOWLP stands for Fan out wafer level packaging, which is a type of chip packaging technology in the semiconductor industry.
What Is a NOR Gate in Simple Terms?
A NOR gate is a logic gate that performs a Boolean operation on its input signals.
What Is a Chip Defect?
A defect refers to any physical or chemical imperfection in the crystal lattice structure that can affect the electrical or optical properties of a semiconductor device.
What Is a Semiconductor? In Simple Terms
A semiconductor is a type of material that has an electrical conductivity between that of a conductor, such as copper, and an insulator, such as glass.
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