Front-end vs Back-end in Semiconductors: 7 Differences
The front-end and back-end are highly interdependent. A constant feedback loop between front and back-end engineers is necessary to improve manufacturing yields.
21 April 2024
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Through-Silicon Vias: Interconnecting Chip Layers
Built directly into the silicon, through silicon vias (TSV) facilitate 3D IC integration and allow for more compact packaging. They have become the default solution to interconnect different chip layers or to stack chips vertically.
4 April 2024
SiC vs GaN Transistors
Silicon carbide (SiC) is used in electric vehicles due to its wide bandgap and great thermal conductivity. Gallium nitride (GaN) shares many characteristics with SiC while also minimizing RF noise.
16 February 2024
Game On? AI’s Journey Ahead in Video Games
Generative AI for video games is still far from being real. The main challenges are latency of cloud gaming and the very high cost of
4 February 2024
From Linux to RISC-V: A Journey of Open-Source Innovation in the Data Center
RISC-V, an open standard instruction set architecture (ISA), could have the potential to mirror the success of Linux two decades later, but in the hardware domain.
19 January 2024
Will GPUs Replace CPUs? A Short Guide
GPU vs CPU is a parallelization vs complexity dilemma. While GPUs can manage very large parallel calculations, they struggle with linear, more heterogeneous tasks, where CPUs excel.
3 January 2024
Direct-to-Chip Cooling In The Data Center
AI workloads require more server density and generate more heat. Direct-to-chip liquid cooling is emerging as the preferred cooling solution for AI with leaders like Meta, Google or Equinix adopting it.
29 December 2023
The CFET Transistor: Shrinking Nodes Beyond 2030
The move to CFET vs GAAFET marks a switch from horizontally stacked transistors to vertically stacked ones. This will allow further shrinking of semiconductor patterns and the advancement of Moore´s Law.
18 December 2023
GAAFET vs FinFET: “Transistoring” to All-Around Nanosheets
GAAFET vs FinFET marks an advancement in multigate transistors, shifting the conducting channel from vertical fins to nanosheets.
7 December 2023
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