Wire Bond vs Flip-Chip: 7 Differences
Wire bonding is a cheap and reliable semiconductor packaging method- Flip-chip is an advancement, creating more dense interconnections and allowing 3D vertical stacking.
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Understanding Fab Yield in Semiconductors
Fab yield refers to the percentage of working chips in a semiconductor wafer. If a fab can’t meet the requirements, customers will switch to another provider.
Smartphone AI Is Coming: What’s Next?
Smartphone on-device AI is expected by 2024, and will likely be combined with cloud AI. Smartphone makers will capitalize on it by increasing prices.
The Challenges of Analog IC Design Explained
Analog IC design involves working with continuous signals like voltage or temperature, where components can introduce interferences. To master analog design, hands-on experience is crucial.
SaaS vs On-Premise Software: Differences
SaaS requires less investment in hardware, is simpler and facilitates scalability. On-premise allows for more customization but management is more complex.
Logic vs Memory Chips: 9 Differences
Logic chips are the “brains” of the electronic device. They process information and perform calculations. Memory chips store information and data.
FinFET vs MOSFET (Planar) Transistors in Chip Design
FinFETs are three-dimensional transistors with vertical fins that solve most of the problems related to planar MOSFET, such as leakage current or short channel effects.
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