Techlevated

Joined: 11 May 2023
Articles: 54

Uncategorised

Evolution of Metal Pitch in Semiconductor Transistors

The metal pitch refers to the distance between the centers of two adjacent metal interconnect lines on an integrated circuit (IC). Since transistors evolved into 3D strucrures, this measurement has lost significance.

Techlevated
23 May 2024

Semiconductors, Uncategorised

Front-end vs Back-end in Semiconductors: 7 Differences

The front-end and back-end are highly interdependent. A constant feedback loop between front and back-end engineers is necessary to improve manufacturing yields.

Techlevated
21 April 2024

Semiconductors

Through-Silicon Via: Interconnecting Chip Layers

Built directly into the silicon, through silicon vias (TSV) facilitate 3D IC integration and allow for more compact packaging. They have become the default solution to interconnect different chip layers or to stack chips vertically.

Techlevated
4 April 2024

Semiconductors

SiC vs GaN Transistors

Silicon carbide (SiC) is used in electric vehicles due to its wide bandgap and great thermal conductivity. Gallium nitride (GaN) shares many characteristics with SiC while also minimizing RF noise.

Techlevated
16 February 2024

Uncategorised

Game On? AI’s Journey Ahead in Video Games

Generative AI for video games is still far from being real. The main challenges are latency of cloud gaming and the very high cost of AI chiplets, unafforadble for consumers.

Techlevated
4 February 2024

DATA CENTER, Semiconductors

From Linux to RISC-V: A Journey of Open-Source Innovation in the Data Center

RISC-V, an open standard instruction set architecture (ISA), could have the potential to mirror the success of Linux two decades later, but in the hardware domain.

Techlevated
19 January 2024

AI, DATA CENTER, Semiconductors

Will GPUs Replace CPUs? Understanding Core Differences

GPU vs CPU is a parallelization vs complexity dilemma. While GPUs can manage very large parallel calculations, they struggle with linear, more heterogeneous tasks, where CPUs excel.

Techlevated
3 January 2024

AI, DATA CENTER

Direct-to-Chip Cooling In The Data Center

AI workloads require more server density and generate more heat. Direct-to-chip liquid cooling is emerging as the preferred cooling solution for AI with leaders like Meta, Google or Equinix adopting it.

Techlevated
29 December 2023

Semiconductors

The CFET Transistor: Shrinking Nodes Beyond 2030

The move to CFET vs GAAFET marks a switch from horizontally stacked transistors to vertically stacked ones. This will allow further shrinking of semiconductor patterns and the advancement of Moore´s Law.