Semiconductors
Silicon carbide (SiC) is used in electric vehicles due to its wide bandgap and great thermal conductivity. Gallium nitride (GaN) shares many characteristics with SiC while also minimizing RF noise.
16 February 2024
Semiconductors
AI
GPU vs CPU is a parallelization vs complexity dilemma. While GPUs can manage very large parallel calculations, they struggle with linear, more heterogeneous tasks, where CPUs excel.
3 January 2024
Semiconductors
The move to CFET vs GAAFET marks a switch from horizontally stacked transistors to vertically stacked ones. This will allow further shrinking of semiconductor patterns and the advancement of Moore´s Law.
18 December 2023
Semiconductors
GAAFET vs FinFET marks an advancement in multigate transistors, shifting the conducting channel from vertical fins to nanosheets.
7 December 2023
Semiconductors
Wire bonding is a cheap and reliable semiconductor packaging method- Flip-chip is an advancement, creating more dense interconnections and allowing 3D vertical stacking.
28 November 2023
Electronics
Fab yield refers to the percentage of working chips in a semiconductor wafer. If a fab can’t meet the requirements, customers will switch to another
22 November 2023