Network latency refers to the delay or amount of time it takes for information to travel from one point to another across a network. Imagine you are sending a message to your friend who is far away. The time it takes for your message to reach your friend and for their response to come back to you is what we call latency.
Network latency can be affected by different factors like the distance between the sender and receiver, the speed and reliability of the network or the number of devices the data needs to pass through. So, if you are playing an online game or having a video chat, high latency can cause delays in your actions or conversations.
The metal pitch refers to the distance between the centers of two adjacent metal interconnect lines on an integrated circuit (IC). Since transistors evolved into 3D strucrures, this measurement has lost significance.
The front-end and back-end are highly interdependent. A constant feedback loop between front and back-end engineers is necessary to improve manufacturing yields.
Built directly into the silicon, through silicon vias (TSV) facilitate 3D IC integration and allow for more compact packaging. They have become the default solution to interconnect different chip layers or to stack chips vertically.
Silicon carbide (SiC) is used in electric vehicles due to its wide bandgap and great thermal conductivity. Gallium nitride (GaN) shares many characteristics with SiC while also minimizing RF noise.
Generative AI for video games is still far from being real. The main challenges are latency of cloud gaming and the very high cost of
RISC-V, an open standard instruction set architecture (ISA), could have the potential to mirror the success of Linux two decades later, but in the hardware domain.
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