Fluxless TCB vs TCB
As interconnection pitches shrink below 10µm for advanced logic and memory applications, fluxless TCB solves the issues that standard TCB encounters with the flux.
22 February 2025
Techlevated
Semiconductors, Cloud & Software and more
Evolution of Metal Pitch in Semiconductor Transistors
The metal pitch refers to the distance between the centers of two adjacent metal interconnect lines on an integrated circuit (IC). Since transistors evolved into 3D strucrures, this measurement has lost significance.
23 May 2024
Front-end vs Back-end in Semiconductors: 7 Differences
The front-end and back-end are highly interdependent. A constant feedback loop between front and back-end engineers is necessary to improve manufacturing yields.
21 April 2024
Through-Silicon Via: Interconnecting Chip Layers
Built directly into the silicon, through silicon vias (TSV) facilitate 3D IC integration and allow for more compact packaging. They have become the default solution to interconnect different chip layers or to stack chips vertically.
4 April 2024
SiC vs GaN Transistors
Silicon carbide (SiC) is used in electric vehicles due to its wide bandgap and great thermal conductivity. Gallium nitride (GaN) shares many characteristics with SiC while also minimizing RF noise.
16 February 2024
Will GPUs Replace CPUs? Understanding Core Differences
GPU vs CPU is a parallelization vs complexity dilemma. While GPUs can manage very large parallel calculations, they struggle with linear, more heterogeneous tasks, where CPUs excel.
3 January 2024
Direct-to-Chip Cooling In The Data Center
AI workloads require more server density and generate more heat. Direct-to-chip liquid cooling is emerging as the preferred cooling solution for AI with leaders like Meta, Google or Equinix adopting it.
29 December 2023
The CFET Transistor: Shrinking Nodes Beyond 2030
The move to CFET vs GAAFET marks a switch from horizontally stacked transistors to vertically stacked ones. This will allow further shrinking of semiconductor patterns and the advancement of Moore´s Law.
18 December 2023
GAAFET vs FinFET: “Transistoring” to All-Around Nanosheets
GAAFET vs FinFET marks an advancement in multigate transistors, shifting the conducting channel from vertical fins to nanosheets.
7 December 2023
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