The metal pitch refers to the distance between the centers of two adjacent metal interconnect lines on an integrated circuit (IC). Since transistors evolved into 3D strucrures, this measurement has lost significance.
The front-end and back-end are highly interdependent. A constant feedback loop between front and back-end engineers is necessary to improve manufacturing yields.
Built directly into the silicon, through silicon vias (TSV) facilitate 3D IC integration and allow for more compact packaging. They have become the default solution to interconnect different chip layers or to stack chips vertically.
Silicon carbide (SiC) is used in electric vehicles due to its wide bandgap and great thermal conductivity. Gallium nitride (GaN) shares many characteristics with SiC while also minimizing RF noise.
GPU vs CPU is a parallelization vs complexity dilemma. While GPUs can manage very large parallel calculations, they struggle with linear, more heterogeneous tasks, where CPUs excel.
AI workloads require more server density and generate more heat. Direct-to-chip liquid cooling is emerging as the preferred cooling solution for AI with leaders like Meta, Google or Equinix adopting it.
The move to CFET vs GAAFET marks a switch from horizontally stacked transistors to vertically stacked ones. This will allow further shrinking of semiconductor patterns and the advancement of Moore´s Law.
GAAFET vs FinFET marks an advancement in multigate transistors, shifting the conducting channel from vertical fins to nanosheets.
Wire bonding is a cheap and reliable semiconductor packaging method- Flip-chip is an advancement, creating more dense interconnections and allowing 3D vertical stacking.
The information provided on this site is for informational purposes only. The content is based on the authors´ knowledge and research at the time of writing. It is not intended as professional advice or a substitute for professional consultation. Readers are encouraged to conduct their own research and consult with appropriate experts before making any decisions based on the information provided. The blog may also include opinions that do not necessarily reflect the views of the blog owners or affiliated individuals. The blog owners and authors are not responsible for any errors or omissions in the content or for any actions taken in reliance on the information provided. Additionally, as technology is rapidly evolving, the information presented may become outdated, and the blog owners and authors make no commitment to update the content accordingly.
